JPH0528763Y2 - - Google Patents

Info

Publication number
JPH0528763Y2
JPH0528763Y2 JP12127086U JP12127086U JPH0528763Y2 JP H0528763 Y2 JPH0528763 Y2 JP H0528763Y2 JP 12127086 U JP12127086 U JP 12127086U JP 12127086 U JP12127086 U JP 12127086U JP H0528763 Y2 JPH0528763 Y2 JP H0528763Y2
Authority
JP
Japan
Prior art keywords
resin
bonding
stamp
squeegee
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12127086U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327039U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12127086U priority Critical patent/JPH0528763Y2/ja
Publication of JPS6327039U publication Critical patent/JPS6327039U/ja
Application granted granted Critical
Publication of JPH0528763Y2 publication Critical patent/JPH0528763Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
JP12127086U 1986-08-06 1986-08-06 Expired - Lifetime JPH0528763Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12127086U JPH0528763Y2 (en]) 1986-08-06 1986-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12127086U JPH0528763Y2 (en]) 1986-08-06 1986-08-06

Publications (2)

Publication Number Publication Date
JPS6327039U JPS6327039U (en]) 1988-02-22
JPH0528763Y2 true JPH0528763Y2 (en]) 1993-07-23

Family

ID=31010381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12127086U Expired - Lifetime JPH0528763Y2 (en]) 1986-08-06 1986-08-06

Country Status (1)

Country Link
JP (1) JPH0528763Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015141931A (ja) * 2014-01-27 2015-08-03 三菱電機株式会社 樹脂供給装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5009354B2 (ja) * 2009-11-30 2012-08-22 キヤノンマシナリー株式会社 塗布装置
KR101165360B1 (ko) 2010-11-26 2012-07-12 주식회사 프로텍 다이 본더용 접착제 스탬핑 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015141931A (ja) * 2014-01-27 2015-08-03 三菱電機株式会社 樹脂供給装置

Also Published As

Publication number Publication date
JPS6327039U (en]) 1988-02-22

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